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Preparation of uniform prototype
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Europe/Paris
Workshop (IJCLab)
Workshop
IJCLab
Participants: Roman, Jimmy, Vincent, Jérôme, Adrián, Dominique, Dirk, Taikan
News from IJClab (Roman)
- HV Kapton
- 25 ordered, will be delivered the 30/10.
- small changes: no more sidebands, vias are covered, longer connection strip, thickness 310±10μm.
- price ~ 3k€ ~ 120€/pce
- PCB Metrology before cabling
- 25 pces ~ 1 day of measurement.
- Mechanical measurement shows deformation of 200 (typical)–400μm
- Vincent: ➞ 100μm additional space on the edge of wafers
- Adrián:
- Mecha. meas. show only the deformation of the PCB under its weight ~ almost always the same for all ➞ no information.
- 💡 Compare by reversing the PCB (for a couple of them)
- Atypical one 400μm but reversed deformation.
- Mecha. meas. show only the deformation of the PCB under its weight ~ almost always the same for all ➞ no information.
- DAQ
- New DAQ computer with plenty of disk
- Disk server (rack) still avail. until failure...
- Window 11 : will need test !!!!
- New DAQ computer with plenty of disk
- Wafers
- 22 wafers : tests in IJCLab.
- last time currents were a factor 2 below HPK.
- Will need to find a slot;
- Vincent: Yukun could help.
- Cabling
- Dominique: machine slots: within next 2 weeks
- couple of days of prep. + 1 day.
- soldering of connectors by hand
- couple of days of prep. + 1 day.
- ➞ End of October
- NEEDS urgently the resistance values for optimal TDC response.
- Dominique: machine slots: within next 2 weeks
➞ Material send to IFIC beg of November :
DMLab (Dirk)
- 3M stopped the production of A4 sheets of double-side tape.
- continues rolls only: 3m×60m , 5k€ pce !!
- but they are reactive!
- looked for spare market & found 3Market.de :
- 50 sheets in stock…
- 29 pces ordered
- also sold in ≠ thickness by steps of 50μm.
- new design for holes.
- ⬌ IFIC
News from IFIC
- Wafers measurements (Japan ones to be brought by Taikan)
- 2 days / sensors ➞ 20–30 by February
- 3M tape:
- new holes pattern ➞ DMLab
- but C. Orero in "inter-contract"
- Manpower: ≥ end November.
- +1 students in Jan.
- new holes pattern ➞ DMLab
- Glue:
- H20E: available (10 oz) but expires in March, Enough for 10 mod.
- last time: needs to 2 steps, fast heating (140 °C), 1 days of preparatation
- Mono-component
- Much less cumbersome.
- worked fine for ECALp; 1‰ missed dots (smaller, too long in syringe)
- now: 80–100 °C longer time (2-3h)
- Dirk + Dominique: is lower temp+longer heating better? lower temp is better....
- H20E: available (10 oz) but expires in March, Enough for 10 mod.
- Metrology: 2–3 months ➞ end feb.
- Assembly / Hybridization
- Tests in Jan. with 2 modules mono-component glue.
- Prod. (10) in March
Wafers:
- IFIC: 7
- IJClab 4 (from 12), now at IFIC
- LLR: 22, now at IJCLab
- KEK 10
- Kyushu 8
tot = 11+4+22+10+8 = 55 ➞ enough for 12.75 cards
Roman: @Taikan do you have a spare 500μm wafer? Taikan prefers to keep margins
➞ make 12 ASUs
DAQ:
- SLBoards OK ?
- Needs adaptation for HV + Probe.
- 1–2 ASU ➞ IFIC
Support & Logistics:
- Transport boxes must be purchased / built.
- New rails will be produced.
- W plates are unchanged.
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