Présidents de session
Monolithic sensors
- Christine HU-GUO (IPHC)
Monolithic sensors
- Walter Snoeys (CERN)
While silicon industry advances to smaller and smaller feature sizes, silicon particle detectors struggle to follow that miniaturisation. One of the main bottlenecks are the relatively large transistors required for the optimal performance of the analogue frontend. Particam instead uses a digital only approach which is focused on digital storage cells switching due to transient radiation...
Last advanced TEM techniques are dedicated to the observation of sensitive materials which can be damaged with the electron dose, such as biological specimen. In this situation it is mandatory to use a low dose and conventional beam energies (200keV). Consequently, electron detectors need to have a gain as high as possible while maintaining high spatial resolution performances. Nowadays,...
CMOS image sensors (CIS) are the leading imaging technology today. Sensors as large as a wafer can be manufactured thanks to the so-called stitching method. The architecture of existing wafer-scale CIS products is fairly simple, with the sensors representing only a relatively limited advantage in terms of speed, with respect to other technologies, e.g. a-Si panels or CCDs. This work presents...
For particle counting detectors with high repetition rate, low latency and low jitter using direct detection of incident electrons, a short transit time of the secondary generated electrons and holes within the pixel structure is required. Additionally, for a pixel array that spans a large area, we wish to minimize the overall power consumption by minimizing the number of pixels, implying...
The CMOS Sensor MIMOSIS is being developed to equip the Micro Vertex Detector (MVD) of the CBM experiment at FAIR in Darmstadt, Germany. It will feature 1024 × 504 pixels and combine a time resolution of 5 µs with a spatial resolution of ∼ 5 µm. Moreover, it will have to handle a peak rate of 80 MHz/cm² and radiation doses of 5 MRad and up to 1e14 neq/cm² per year. It is being developed within...
MALTA2 is a Depleted Monolithic Active Pixel Sensor designed to meet the challenging requirements of future collider experiments, in particular extreme radiation tolerance and high hit rate . It is fabricated in a modified Tower 180 nm CMOS imaging technology to mitigate performance degradation caused by irradiation up to 100 MRad of Total Ionising Dose and $3 \times...
The DESY II Test Beam Facility offers electrons with a user selectable momentum ranging from 1-6 GeV alongside beam telescopes as precise reference tracking systems. Whilst providing a very high spatial resolution, they provide no timestamps for individual hits within the readout frame. The length of this readout frame means the telescopes frequently read out hits from multiple electrons...
The increasing segmentation of sensors, especially in tracking and vertexing applications, along with the drive to reduce the material budget, necessitates that processing of charge signals from sensors through amplification, filtering, extraction of amplitude, time of occurrence, as well as of additional features, such as particle trajectory direction and type identification, be confined to...
ALICE (A Large Ion Collider Experiment) is one of the four main experiments at the CERN Large Hadron Collider (LHC), and it is mainly designed to study heavy-ion collisions at ultra-relativistic energies. In view of the LHC Run 4, foreseen to start in 2029, ALICE will replace the three innermost cylindrical layers of its current inner tracking system (ITS2) during the Long Shutdown 3...
The adoption of monolithic active pixel sensors (MAPS) in CMOS technologies for high-energy physics experiments was a breakthrough. These pixel detectors can achieve a material budget as low as 0.1% of the radiation length per layer, as they integrate the readout electronics within the sensor itself.
After the successful installation of the ITS2 detector, covering 10 m² with MAPS, a further...
The high energy physics community recently gained access to a 65 nm CMOS imaging process, which enables a higher density of in-pixel logic in monolithic active pixel sensors (MAPS). To explore this novel technology, the H2M (Hybrid-to-Monolithic) test chip has been designed and manufactured. The design followed a digital-on-top design workflow and ports a hybrid pixel-detector architecture,...
Monolithic CMOS sensors combine the sensing volume and the processing electronics in the same die, leading to complex shapes of doped regions with various concentrations. As a consequence, the electric field in such sensors cannot be accurately expressed analytically. Considering the importance of the charge propagation process on the signal formation in the pixels, the electric field is...
The performance of monolithic CMOS pixel sensors depends on their fabrication process and especially the feature size which directly drives the pixel size. A consortium led by the CERN EP R$\&$D program, the ALICE experiment, and various European projects (AIDAinnova, EURIZON) is investigating the benefits of a 65~nm CMOS imaging process to design a new generation of pixel sensors. These...
The TaichuPix chip is a dedicated monolithic CMOS pixel sensor developed for the first 6-layer silicon vertex detector prototype for the Circular Electron Positron Collider (CEPC) vertex detector R&D. Two small-scale demonstrator chips (25 mm$^2$) had been designed to optimize the in-pixel circuit and readout architecture, and to verify the radiation hardness. The promising test results of the...
