Eleventh International Workshop on Semiconductor Pixel Detectors for Particles and Imaging

Scientific Program

Invited speakers

• Gzregorz Deptuch (BNL Upton)
  Enhancing Sensor Readout Efficiency: Innovations and Challenges
• Claire Juramy (LPNHE Paris)
  Pixel sensors used in telescopes for space observation
• Marco Mandurrino (INFN Torino)
  Realistic Monte Carlo simulation of silicon particle detectors for timing and tracking with Garfield++
• Andrei Nomerotski (Florida International University and Czech TU Prague)
  Time-stamping photons with sub-nanosecond resolution for quantum-enhanced imaging and telescopy
• Alexandre Oh (Manchester University)
  Wide band-gap material sensors for applications in high energy physics experiments
• Renato Turchetta (IMASENIC Barcelona)
  Scientific imaging sensors for medical and life science applications
• Anabela Veloso (IMEC Leuven)
  Entering a New Era of Innovation in Semiconductor Technologies with Increased Interdisciplinary Synergies for
  Advanced Compute Scaling

High energy and nuclear physics experiments

Operation and performances of running pixel detectors, R&D on upgrade or future pixel detectors

Astrophysics applications

Application of pixel sensors in astronomy, astrophysics and/or in-space (balloons, satellite)

Applications in biology, medical imaging

Photon science applications

Radiation tolerance

Studies of radiation damage of running pixel detectors, R&D to reach higher radiation tolerance

Timing with pixels

Performance of running pixel detectors dedicated to 4D tracking or particle identification, R&D to improve time resolution of pixel sensors

Monolithic sensors

R&D on verious monolithic technologies like: CMOS pixel sensors (MAPS), Silicon On Insulator (SOI), Depleted field effect transistors (DEPFET)

Sensing materials development

The topic includes a broad range of materials such as solid-state (diamond, SiC, organic, ...) or gazeous (liquid nobles, ...)

Electronics

Read-out ASICs, powering, data acquisition system, monitoring system

Integration in detection modules and structures

Mechanics, cooling, interconnection and assembly techniques