Présidents de session
Sensing materials & Radiaiton tolerance
- Frédéric MOREL (IPHC)
Sensing materials & Radiaiton tolerance
- Christian Finck (CNRS - IPHC)
Documents de présentation
In this presentation the latest developments on detectors made of wide-band-gap materials for applications in high energy physics experiments will be discussed. In particular the status of SiC, GaN and Diamond based detector developments will be reviewed and the plans of the newly formed DRD3 collaboration with it's focus on wide-bandgap materials in working group 6 will be...
In the hadron collider experiments, many silicon detectors have been used for the tracking detection. When these semiconductor detectors are exposed to high radiation level, their detector performances are degraded by the radiation damage. It becomes a serious problem for the future collier experiment expected higher radiation levels. Therefore, new semiconductors in place of silicon with high...
This contribution will delve into the design and performance of the newly produced Silicon Carbide Low Gain Avalanche Detectors (4H-SiC LGADs) and provide a comprehensive summary of their measured characterizations. This includes an analysis of the detector's performance, temperature stability, and the effectiveness of the internal gain layer in improving signal generation.
The 4H-SiC is...
Future high-energy and high-intensity colliders, such as the Muon Collider or the FCC-hh, require precise particle tracking in space and time up to very high fluences, above 10
To design future tracker detectors able to operate in very harsh radiation conditions, it is necessary to manufacture new sensors which...
Simulation-guided design represents a fundamental contribution towards the development of modern semiconductor devices aiming to reach high-performance particle detection, identification and tracking, and constitutes a strategic element of the new detector R&D roadmap.
At the same time, the complexity of microelectronic structures and the related detection systems is drastically increasing,...
The tracking performance of the ATLAS detector relies critically on its 4-layer Pixel Detector. As the closest detector component to the interaction point, this detector is subjected to a significant amount of radiation over its lifetime. At present, at the start of 2024-Run3 LHC collision ATLAS Pixel Detector on innermost layers, consisting of
planar and 3D pixel sensors, will operate after...
Radiation damage significantly impacts the performance of silicon tracking detectors in Large Hadron Collider (LHC) experiments such as ATLAS and CMS, with signal reduction being the most critical effect. While adjusting sensor bias voltage and detection thresholds can help mitigating these effects, generating simulated data that accurately mirrors the performance evolution with the...
This article presents a new global shutter pixel design with radiation-hardened-by-design(RHBD) device modifications and correlated double sampling (CDS). Global Shutter Imagers presents undeniable advantages by exposing all pixels simultaneously. Once in-pixel storage is included, the pixel readout can be operated simultaneously with exposure, enabling faster operation and flashed light....
CMS will undergo a major upgrade to prepare for the High-Luminosity phase of the LHC. Within the frame of this upgrade, studies on a novel passive sensor production technique for planar hybrid detectors have been performed. The sensors were produced using a commercial CMOS production process with a feature size of 150nm. This process enables the use of stitching to produce large sensors out of...
