Présidents de session
System integration
- Maciej Kachel (IPHC C4Pi)
System integration
- claudia gemme (INFN Genova)
System integration
- claudia gemme (INFN Genova)
The current programme of upgrades to the ATLAS detector to take advantage of the opportunities presented by the HL-LHC will include a complete replacement of the tracking system. This upgrade will install an all-silicon tracker called the ITk, the innermost five layers will be made up of Si Pixel detectors.
The majority of the installed Si detectors are Quad Pixel detectors. These are ~4x4...
The LHC will undergo an upgrade known as the High Luminosity LHC (HL-LHC), with the aim of delivering 3000 fb-1. The Compact Muon Solenoid (CMS) detector will be upgraded during the Phase-II upgrade to profit from the increased luminosity delivered by HL-LHC. As a part of the Phase-II upgrade, the CMS tracking detector will be replaced. In the regions closest to the beam, the Phase-II Inner...
The High-Granularity Timing Detector (HGTD), a novel detector based on Low Gain Avalanche Detector (LGAD) technology, being bult for ATLAS Phase 2 upgrade to help mitigate the effects of increased pileup at the HL-LHC by providing high-precision timing information, measuring charged-particle trajectories in time as well as space. In addition, it will provide an instantaneous measurement of the...
The Belle II experiment is planning an all-pixel upgrade of the vertex detector around 2029-2030, aiming to be more performant in terms of tracking efficiency and more robust against the machine background expected at higher luminosity.
The design of the new Vertex Detector (VTX) is based on five barrel-shaped layers spanning from 14 to 140 mm in radius, equipped with the depleted MAPS chip...
In the development of hybrid pixel detectors, a reliable and cost-effective interconnect technology is paramount. This technology must be tailored to the specific pitch and die sizes of the applications at hand. Particularly crucial during the ASIC and sensor development phases, these interconnection technologies must also accommodate the assembly of single dies, commonly available from...
This work presents a novel, patent-pending solution for the packaging of ALPIDE chips that facilitates non-planar assembly with a minimal material budget. This solution represents an advancement based on methodologies developed for the ALICE ITS1 and the STAR tracker two decades ago. The core of this approach involves the use of flexible cables composed of aluminum and polyimide, with...
The Mu3e experiment searches for the lepton flavour violating decay µ→ eee with an ultimate aimed sensitivity of 1 event in 10^16 decays in phase 2. This goal can only be achieved by reducing the material budget per tracking layer to X/X0 ≈ 0.1 %. For this purpose, gaseous helium is chosen as coolant, while High-Voltage Monolithic Active Pixel Sensors (HV-MAPS) thinned to 50 µm constitute the...
