Meeting ITk LPNHE


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- Francesco, Pascal, Mykola, Giovanni C, Marc, Brigitte, Artur, Luc



- Wirebonding

* SCC bad quality, some not usable. 3/10 observed not good, contact wurth and other for our card productions

* Metal plate out of stock

* 3x GO Quad : alignment phase, optimized parameters for bonding (8.4 g mean), not bond mod6 chip4 and mod8 chip4

* Solder type, so far used Pb

- Assembly

* Glue depositions test done. Results not obvious to understand, two values obtained, both high. To retry with new stencil / metal jig.

- Testing

* Cold setup for cycles OK and in the QC chain of the cluster

- Tools & Setup

* X-ray tube: no advancement, we need to find a date to meet and discuss the specs of the shielding

There are minutes attached to this event. Show them.
    • 2:00 PM 2:05 PM
      General news 5m
    • 2:05 PM 2:25 PM
      Wire bonding 20m
      Speakers: Brigitte DELAMOUR ({CNRS}UMR7585) , pascal corona (LPNHE)
    • 2:25 PM 2:45 PM
      Mechanics 20m
      Speaker: Yann Orain
    • 2:45 PM 3:05 PM
      Sensors & Module Assembly 20m
      Speakers: Giovanni Marchiori (APC Paris) , Marco Bomben (APC)
    • 3:05 PM 3:25 PM
      DAQ & Electronics 20m