Join Zoom Meeting
https://cern.zoom.us/j/94940524377?pwd=dnI4NnZUWGNMN1ZpRFJncFU1ZlMrQT09
Present:
- Francesco, Pascal, Mykola, Giovanni C, Marc, Brigitte, Artur, Luc
Topics:
- Wirebonding
* SCC bad quality, some not usable. 3/10 observed not good, contact wurth and other for our card productions
* Metal plate out of stock
* 3x GO Quad : alignment phase, optimized parameters for bonding (8.4 g mean), not bond mod6 chip4 and mod8 chip4
* Solder type, so far used Pb
- Assembly
* Glue depositions test done. Results not obvious to understand, two values obtained, both high. To retry with new stencil / metal jig.
- Testing
* Cold setup for cycles OK and in the QC chain of the cluster
- Tools & Setup
* X-ray tube: no advancement, we need to find a date to meet and discuss the specs of the shielding
