Vidyo conf https://vidyoportal.cern.ch/join/bvavdWAAVCg1
- mainteinance of the wirebonding machine ongoing. No errors were detected during maintenace, no problem was apparently found and solved except the rigidity of an ethernet cable of the camera.
- we asked for firmware&software updates + scheduled mainteinance and then ship back the machine after few days of testing
- the machine is going back at its place, but in case it is still malfunctioning we will try with an UPS or a change of location
- we must prepare material to test the wb machine before it comes back (~ 2 weeks from now):
* SCC PCB
* Glue a couple of red chips on bad PCBs and a yellow chip on a good PCB
- Quad wirebonding map in progress, no news from CEA tests
- Metrology of our gluing tool: it's not usable to stay within 15 um of flatness, the tool is badly deformed (~100 um depression in the middle)
- Vacuum for metrology:
* triphase for the pump to be installed soon
* tubes&material to route the vacuum near the metrology machine ordered, it will arrive in ~10 days
