Partecipants: L3 students, Matteo, Piero, Yann, Stephanie, Thiziri, Giovanni, Paul, Francesco, Yahya, Reina, Pascal, Julien, Marc
General news:
- Column to be masked are more frequent on the flex-mounted modules instead of SCC. Maybe ESD?
- It is possible to make an analysis from the PDB.
- Flex PRR but without circulating information
- Review to buy the wafers of V2 soon
Wirebonding:
- Ball bonding head was OK until friday
- Wedge re-installed on friday but not operational. Many bugs. Investigating with MB. Intervention from MB tomorrow.
- We will try to unplug it today and power it again tomorrow
- Maintenance in february week of 19
Assembly/Metrology:
- Confocal led working. A bit noisy but the expert is not worried.
- Confirmed that we can make the planarity measurement with the confocal led but the planarity tool is not flat enough.
- We can try to flatten it in the lab? To be investigated
Testing:
- Significant speedup on the analog readback measurements
- Electric test is 3h30 with the old version
- 2h15 with the new version
- Parallelism demonstrated to have little impact
- Digital 30m
- We need to produce a second unit to test 2x module parallelism
- DCS OK, dew point calculation on KD board implemented
- Temperature 8x modules
- SHT85
- Pression 2x
- Dew point calculated with own temp using SHT85 up to -40 C then using chamber temperature
- Interlock board firmware updated, card to be reinstalled tomorrow
Xray:
- It works. To be correctly estimated in terms of time
- Meeting next week 31/1 to decide how to install
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