Presents: Hanane, Julien, David Marc, Karim, Pascal, Marco B, Eric, Yann, Giovanni C, Francesco, Paul
General news:
- ITkPixV2 received
- We need to vote for the ITk PL, both candidates are very good
- Hybridisation: Leonardo corrected the alignment problem with the new batch (Milan has received 24x100 3D modules); Advacam received back the problematic 100 um Micron modules and is going to open them to check the reason of the low bumps yield
Wirebonding:
- ParisPreProd01 was cabled and worked well ... until a little accident during HV wire placing and now it is not working anymore
- We do not see wires touching, no idea where the problem is
- Last option: remove the suspected wires and see if 3/4 of the FEs come back
- Dummy bonding are done. We can attempt SQ on 7.2
Assembly:
- Last week it was impossible to work due to temperature. Agilent not working. Temperature over 26 C
- This morning (24 C) I made 4x IV
- We can continue gluing
- The two glued module for Japan are going back. Ask Koji/Manabu where the modules are.
Testing:
- Monitoring card for humidity: the schema that was working on the breadboard but not on the cabled card. Investigating (Karim)
- Carte interlock (Hanane): good progress, microcontroller and FPGA usable
- Standard 640 MBps system installed on the old DAQ PC and working
- Need to update fw to enable LP mode, but all other tests are possible -> SQ is possible
- High speed FW development stalled a bit
- Installed BDAQ card in the xray setup (in preparation of ITkPixV2 tests)
Xray:
- No luck with orders ... adhesive vinyl to cover it
Testbeam:
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