Present: Yann, Pascal, Marco, Giovanni M, Julien, Philippe, David, Paul, Giovanni C, Tony, Lakou, Luc
General news:
- Specs of the flex will be relaxed
- We received yellow chip ITkPix single chip
- No further delays for the gluing tool: a tool is expect by end of january
Wirebonding
- New tool tested, net to net on dedicated card, bond strength a bit low (5 mean, max 7.2)
- Need red chip to test
- Clean room OK, quiet and air is good
- New flex with reduced metal thickness will be good for wirebonding? Ask at the next meeting
- Microscope Keyence
- CERN #26 to debug
Probe station
- Old probestation is OK and utilisable, Agilent is OK
- Irradiated sensors from Lubjana to be measured
- CLAP to be installed the 6/2
Testing
- Multi LV card well advanced
- Header 2.54mm for the extra signal ST+/- ad interlock
- Power to power-adapter with soldered cables
- Scale the system to 8 modules
- Verify max cable size on the green power adapter
Assembly / Metrology
X-Ray
- Lead cover is ongoing
- Electronics is ready to be installed
- Old Coldbox is mounted but foam is broken, ask IRFU
Various
- Upload sensor data in the PDB
- Start to book for the ITk Week
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