Meeting ITk LPNHE

Europe/Paris
Description

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https://cern.zoom.us/j/94940524377?pwd=dnI4NnZUWGNMN1ZpRFJncFU1ZlMrQT09

 

Presents: Thibaud, Brigitte, Lydia, Marc, Giovanni C, Pascal, Yann, Luc, Mykola, Reina, Giovanni M

Wirebonding:

- ITkPix flex is a lot more complex, many worries

- Thibaud has prepared some summary slides https://docs.google.com/presentation/d/1o8cdSnjnMXNNYk5oJneO1F8MCzTJkScy/edit?usp=sharing&ouid=115609126754633036238&rtpof=true&sd=true

- Paris3, Paris14, Paris9 to be wirebonded. Need trim values.

Gluing:

- Received dummies. Organize a gluing session.

- Next week: a presentation from Artur for the alignment helper

Metrology:

- ITkPix flex metrology program first version done, two flexes measured

Testing:

- SLDO VI script completed. To be tested

- Update from Yann about mechanical support: need to order the heatsink to complete the assembly

- Thermal cycles ongoing. Vacuum lost for some modules at under -45 C

X-ray tube:

- Dedicated weekly meeting

- Julien says that there are 4 months minimum latency (certification + authorization)

 

Il y a un compte-rendu associé à cet événement. Les afficher.
    • 10:30 10:35
      General news 5m
    • 10:35 10:55
      Wire bonding 20m
      Orateurs: Brigitte DELAMOUR ({CNRS}UMR7585), pascal corona (LPNHE)
    • 10:55 11:15
      Mechanics 20m
      Orateur: Yann Orain
    • 11:15 11:35
      Sensors & Module Assembly 20m
      Orateurs: Giovanni Marchiori (APC Paris), Marco Bomben (APC)
    • 11:35 11:55
      DAQ & Electronics 20m